Application Announcement
- Update Date：2024-06-17
- Units：Division of International Talent Cultivation
(Deadline :March 28, 2024)-Fall 2024 NYCU xTSMC Elite Scholarship Program for Southeast Asia Students in Semiconductor Field
Elite Scholarship Program for Southeast Asia Students in Semiconductor Field for Fall 2024
The application deadline is extenced to March 28, 2024.
Application Deadline: March 28, 2024. (Extended deadline)
For promising undergraduate seniors who plan to pursue Master’s degree in semiconductor field in NYCU.
Degree Program
Master’s degree program of International College of Semiconductor Technology
Scholarship
The application deadline is extenced to March 28, 2024.
Application Deadline: March 28, 2024. (Extended deadline)
For promising undergraduate seniors who plan to pursue Master’s degree in semiconductor field in NYCU.
Degree Program
Master’s degree program of International College of Semiconductor Technology
Scholarship
- NT 15,000 per month (up to 2 years) provided by TSMC.
- Tuition reduction by NYCU.
- A guarantee 2-month paid summer internship at TSMC.
- Prioritized career opportunities at TSMC upon graduation.
Eligibility
Undergraduate students from the selected universities in Thailand, Vietnam, Indonesia, Singapore & Malaysia.
Major
Focus on Semiconductor Manufacturing (Process, Integration, Packaging).
Major
Focus on Semiconductor Manufacturing (Process, Integration, Packaging).
- Electronic Engineering
- Physics
- Materials Science and Engineering
- Chemistry / Chemical Engineering
- Mechanical Engineering
Chinese Language proficiency ：TOCFL Level 1 or equivalent certificate.
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