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NYCU Office of International Affairs

External Activities

  • Update Date:2026-05-22
  • Units:Division of Strategic Planning
【External Event】2026 Taiwan Semiconductor Career Day|Taiwan, CCU
2026 Taiwan Semiconductor Career Day|Taiwan, CCU

Looking to build your semiconductor career in Taiwan?
Join us on June 5, 2026 at National Chung Cheng University for on-site1:1 interview opportunities with leading semiconductor companies.

Participating Companies:
SPIL|Winbond|Himax|CHIPBOND|ASE

Apply by June 2 to be considered for interview opportunities.
Apply Now: https://global.cake.me/hf1IPe

Event Details
  • Date: Friday, June 5, 2026
  • Time: 13:00–16:00
  • Venue: Banquet Hall, 3rd Floor, East Building, Administration Building, National Chung Cheng University
Who Can Apply
Open to international students and professionals with a bachelor’s degree or higher in STEM-related fields.
Applicants must meet at least one of the following eligibility statuses:
  • Gold Card holder
  • APRC holder
  • ROC citizen spouse residency
  • Graduating international student in Taiwan
  • ARC holder with work permit
  • Overseas candidate requiring visa/work permit application
Required Document: English or Mandarin CV

Interview Application Process
  1. Apply by June 2
  2. Get shortlisted and receive interview confirmation
  3. Attend on-site 1:1 interviews on June 5
Don’t miss this opportunity to connect directly with Taiwan’s leading semiconductor companies and explore your future career in Taiwan!
Apply Now: https://global.cake.me/hf1IPe
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